CLR 1190 / CLH 6140

General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

CLR 1190 / CLH 6230

Room Temperature Cure, Unfilled semi-flexible epoxy coating and casting systems with improved thermal and shock resistance. A low viscosity, clear coating epoxy, material features long pot life and good impact resistance. CLR 1190 / CLH 6230

CLR 1190 / CLH 6372

Solvent resistant. Good Adhesive. A room temperature cure casting system with excellent chemical resistance. When properly post cured, the product is suited for operation at elevated temperatures. CLR 1190 / CLH 6372

CLR 1190 / CLH 6560

Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

CLR 1190 / CLH 6830

5 min. gel general purpose adhesive. A two component, five minute epoxy system with optical clarity and high strength for quick repair applications. CLR 1190 / CLH 6830

CLR 1205 / CLH 6770

Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

CLR 1220 / CLH 6858

5 min. gel general purpose adhesive. A two component, five minute epoxy system with optical clarity and high strength for quick repair applications. CLR 1220 / CLH 6858

CLR 1370 / CLH 6560

General purpose, shock resistant, Room temperature Cure. Excellent Tensile. An adhesive with excellent tensile shear and good peel strength after a 24 hour room temperature cure. Product exhibits excellent shock resistance in potting applications. CLR 1370 / CLH 6560

CLR 1376 / CLH 6930

130°C Operating. Low Exotherm, low shrinkage, excellent shock resistance. A two component epoxy which is recommended for potting and casting transformers, coils and other electronic components. The system provides a good pot life with low exotherm and shrinkage. Cured material has excellent thermal shock resistance. CLR 1376 / CLH 6930

CLR 1396 / CLH 6930

Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930

CLR 1415 / CLH 6220

Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220

CLR 1476 / CLH 6730

Low viscosity epoxy, Suitable for machine dispense, Pot / Cast electronic switches. A low viscosity, general purpose, room temperature curing, epoxy encapsulant. Product is filled with non-abrasive fillers suitable for machine dispensing. Product has good physical, thermal and electrical properties. CLR 1476 / CLH 6730

CLR 1510 / CLH 6580

Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580

CLR 1556 / CLH 6510

Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6510

CLR 1556 / CLH 6520

Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6520

CLR 1556 / CLH 6640

Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640

CLR 1566 / CLH 6020

Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6020

CLR 1566 / CLH 6025

Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6025

CLR 1583 / CLH 6229

Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense. CLR 1583 / CLH 6229

CLR 1710 / CLH 6710

Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710